1 / 5 www.asb.co.kr s e p t e m b e r 2 0 1 7 p lerow tm apm1765 - p29 low noise & high oip3 medium power ampl i fier module parameter unit specifications min typ max frequency range mhz 1750 1780 gain db 35 36 gain flatness db ? 0.3 ? 0.4 noise figure db 1.8 2.0 output ip3 (1) dbm 44 47 s11 / s22 (2) db - 18 / - 10 output p1db dbm 28 29 switching time (3) ? sec - supply current ma 460 500 supply voltage v 5 impedance ? 50 package type & size mm surface mount type, 13wx13lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured wi th two tones at an output power of 15 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage from 0 v to v s . pin number function 3 rf in 8 rf out 10 v s other s ground feature s note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. description apm1765 - p29 asb inc. solder stencil area ? 0.3 plated thru holes to ground plane plerow s 21 = 36.3 db @ 1750 mhz = 35.7 db @ 1780 mhz nf of 1.8 db over fr e quency uncondit ionally stable single 5v supply high oip3 @ low current website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a t ion 2 - stage single type (top view) (bottom view) (side view) 2 x ? 2.0 plated thru holes to screw on heat sinker (recomm ended footprint) ou t line drawing (unit: mm) typ. @ t = 25 ? c, v s = 5 v, freq. = 1765 mhz, z o.sys = 50 ohm specifications (in pr o duction) the plerow tm apm - series is an internally matched amplifier mini - module for such application band in smd package with the output p1db of 29 d bm. it is compactly designed for low current consumption and high oip3. integrating all the components for biasing and matching within the module enhances production yield and throughput as well. it passes through the stringent dc, rf, and reliability test s. not sample test but 100% quality control test is made before packing.
2 / 5 www.asb.co.kr s e p t e m b e r 2 0 1 7 p lerow tm apm1765 - p29 low noise & high oip3 medium power ampl i fier module s - param e ters oip3 p1db pcs rx 1750~1780 mhz +5 v stability fa c tor (k) typical performance (measured) noise figure
3 / 5 www.asb.co.kr s e p t e m b e r 2 0 1 7 p lerow tm apm1765 - p29 low noise & high oip3 medium power ampl i fier module output channel power (@ aclr= - 45dbc, +/ - 5mhz of f set) ** test source : agilent e4433b (3gpp w - cdma test model - 1 64dpch) oip3 vs output power (@ 1mhz offset, 1 - tone power) aclr vs channe l power
4 / 5 www.asb.co.kr s e p t e m b e r 2 0 1 7 p lerow tm apm1765 - p29 low noise & high oip3 medium power ampl i fier module 1) the tantal or mlc (m ulti layer ceramic) capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be determined by customer s dc supply status . the c a- pacitor should be placed as close as possible to v s pin and be connected d irectly to the ground plane for the best electrical performance . 2) dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacito rs are inclu d- ed inside the apm module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e- quency. copyright ? 2009 - 2017 asb inc. all rights reserved. datasheet subject to change without notice. asb assumes no re- sponsibility for any errors which may appear in this datasheet. no part of the datasheet may be copied or reproduced in any form or by any means without the prior written consent of asb. application circuit recommended soldering reflow process 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) + - apm out in c1 c2 v s tantal or mlc (multi layer c e ramic) c a pacitor in out vs evaluation board layout size 40x40mm (for apm series C 13x13mm)
5 / 5 www.asb.co.kr s e p t e m b e r 2 0 1 7 p lerow tm apm1765 - p29 low noise & high oip3 medium power ampl i fier module channel power vs. aclr test configuration apm1765 C p29 evaluation board attached with heat sink evaluation board * in order to prevent damage of d.u.t (apm - series) f rom heating, you must to use a properly sized heat sink for testing a module.
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